Industrial Topics
PRODUCT INNOVATIONS
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Essemtec - Kapillar-Underfiller
Jet dispensing technology for capillary underfiller
Capillary underfiller gained more and more in importance during recent years. The increased use of BGA and flip chip components, improved underfill materials and the use of high precision dispensing systems led from an everyday physical effect to a reproducible high tech process.
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PRODUCT INNOVATIONS
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Olympus - semiconductor wafer inspection
Wafer inspection systems with automated wafer loaders
DEK Solar - thin-film substrates
Photovoltaic metallization platform for the thin-film generation
Siemens Industry Automation Division
New laser scanners safeguard small protection zones and transfer carriages
ANALYSIS-MARKET-TRENDS
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VDMA - electronics production
Electronics production equipment manufacturers expect turnover plus of five percent for 2008
SEMI Silicon Manufacturers Group (SMG)
Silcon wafer shipments contract in third quarter 2008
SEMI - book-to-bill
North American semiconductor equipment industry posts september 2008 Book-to-Bill Ratio of 0.76
NEWS
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Metal-free MID technology
New compound: Laser produces electrically conductive structures
3D-SIC technology
IMEC demonstrates 3D stacked integrated circuits
Fraunhofer ISE
39.7% – New European Record Efficiency for Solar Cells
APPLICATIONS
Pixargus - optical inline inspection system
Complete surface inspection of cables