Industrial Topics 
category PRODUCT INNOVATIONS - Reinhardt Microtech - technology news
Solid copper filled via in thin film technology

Reinhardt Microtech keeps in touch with today’s increasing demands on substrate performance. As the circuits in the field of RF applications are improving in performance, also the substrates which carry the circuits have to. One outstanding example is the use of solid filled via to realize the electrical connections between front and back side of substrates. While many competitors in this field are still struggling with problems, Reinhardt Microtech developed a reliable, high-yield production method therefore. go

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