INDUSTRY TOPICS 
category PRODUCT INNOVATIONS - MOST Cooperation - automotive Ethernet
Automotive-ready physical layer for Ethernet in the car

The MOST Cooperation will demonstrate how MOST can be used as an automotive Ethernet physical layer at the MOST Forum exhibition in Stuttgart, Germany. The multimedia demonstration shows MOST at 150 Mbps bandwidth with high-speed Ethernet packet transport, multi-channel video streaming from HDD as well as isochronous streaming of HDTV and SDTV. go

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Messe München GmbH
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category PRODUCT INNOVATIONS
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Messe München GmbH
Delphi - cable
Halogen-free ultra-thin-wall cable for multiple vehicles go
Epcos - Aluminum electrolytic capacitors
SMD series for consumer and industrial electronics go
AnalogicTech - flash drivers
High current WLED flash drivers offer smaller alternative to xenon lamps go
Messe München GmbH
Messe München GmbH
category ANALYSIS-MARKET-TRENDS
more articles (41) more articles
Messe München GmbH
Messe München GmbH
iSuppli - Microelectromechanical Systems
Sensors take the growth baton in the global MEMS market go
Vishay Siliconix - MOSFETs
p-channel power MOSFETs in the PowerPAK SC-75 go
iSuppli warns:
U.S. falling behind in eco-friendly car electronics go
Messe München GmbH
Messe München GmbH
category NEWS
more articles (48) more articles
Messe München GmbH
Messe München GmbH
Online ticket registration for visitors to the electronica 2008
Be sure to get your entrance ticket now to benefit from attractive prices go
electronica automotive conference:
Secure early booking prices now for the expert forum on automobile electronics go
Joint research project started
BMZ, University of Applied Sciences Aschaffenburg and Linde develop energy storage system for electric vehicles go
Messe München GmbH
Messe München GmbH
category EVENTS
Messe München GmbH
Messe München GmbH
Munich International Congress Center (ICM)
electronica automotive conference 2008 with Experts from Leading International Companies go
Booming market India
"Call for Presentations" for the Automotive Symposium running parallel to "electronicIndia 2008" go
Thurs 19th March 2008, The Royal Society, London
3rd International Conference on Nanotechnology and Smart Textiles for Industry, Healthcare and Fashion go
Industrial Topics 
Computer simuliert Hitzestress category PRODUCT INNOVATIONS - Fraunhofer-Institut für Werkstoffmechanik IWM
Computer simulates thermal stress

A new simulation method has made it possible to predict in record time when and where heavily stressed engine components are likely to fail. Car manufacturers can thereby significantly reduce the time for developing new engine components. go

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category PRODUCT INNOVATIONS
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Messe München GmbH
Messe München GmbH
Schroff - Customising cabinets
Individually modified standard cabinets go
Essemtec - automated stencil printer
New automated printer with sideways moving loading drawer go
3D Systems - 3-D Printer
New affordable, high-definition 3-D printer go
Messe München GmbH
Messe München GmbH
category ANALYSIS-MARKET-TRENDS
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Messe München GmbH
Messe München GmbH
Electronics.ca Publications - Industry Report
40% of the world's PCB is produced in the uppermost manufacturing bases - China and Taiwan go
EMS - ODM - CM Industry
Global contract manufacturing transforms by 2013 go
Silicon solar production initiatives
Thin-film technology - new solar PV trend in Taiwan go
Messe München GmbH
Messe München GmbH
category NEWS
Messe München GmbH
Messe München GmbH
STMicroelectronics, STATS ChipPAC and Infineon
Milestone in establishing wafer-level-packaging industry standard go
Essemtec
New Website with integrated application reports go
At VLSI Symposium
IMEC reports progress on simplified high-k/metal gate process for the 32nm node go
Messe München GmbH
Messe München GmbH
category APPLICATIONS
Messe München GmbH
Messe München GmbH
Heller Industries - Reflow ovens
Reflow ovens solution to the challenges of increased productivity and greater flexibility go