PRODUCT INNOVATIONS
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Closer to zero-defect production - with fast 3D sensors
Components with inferior quality can hinder the productivity of a
placement machine severely. The new Siplace 3D Coplanarity Module from
Siemens Electronics Assembly Systems (EA) makes such limitations a
thing of the past. The new Siplace 3D Coplanarity Module is
particularly attractive for electronics manufacturers who produce for
customers with the highest quality requirements like those in the
automotive, aerospace and medical industries.
The new generation of the coplanarity module with 3D sensors is available immediately for Siemens’s Siplace X2 and X3 placement solutions. Instead of with a laser dot, electronic components are now scanned with a laser line whose scattered-light reflections are converted into height information by a powerful 3D sensor. By analyzing the difference between component and board heights, the system makes sure that all contacts are sufficiently deeply embedded into the solder paste (provided that the solder paste was flawlessly applied). And if the difference of level of the connections for pins and balls exceed a preset tolerance level, the placement heads discards the respective component.
Thanks to its line scanning and 3D sensor technology, the Siplace Coplanarity Module operates twice as fast as competitors’ technologies. For example, scanning a QFP 100 takes less than 600 milliseconds. By eliminating the additional vision test, the system is faster than competitive systems and improves the productivity and efficiency of the entire SMT line.
Quality problems due to insufficient solder connections resulting from bent pins on QFPs, connectors and SO components and incorrectly varying ball diameters on BGAs are reliably prevented. This prevents expensive rework. For example, faulty solder connections on the bottom of BGAs are only detectable with X-ray equipment are very difficult to repair. In addition, customers can rest assured that the durability of modules won't be reduced in the field as a result of unreliable solder connections, which in turn may lead to expensive failures.
Vision dumps for systematic process improvements
Other benefits of the new generation of Siplace Coplanarity Modules include their easy operability and the ability to store vision dumps, i.e. test logs with visual and analytical data). Via software, the user is able to easily configure process parameters such as component tolerances or solder paste thicknesses. The results of the coplanarity tests are output together with the results of the other Siplace vision systems, which makes the manufacturer's quality control and fault analysis procedures a lot easier. In addition, the system stores test logs with visual and analytical information of faulty components. Based on these vision dumps, electronics manufacturers can troubleshoot and improve their processes much more easily and effectively than before. Additionally, error data complaints are easier to explain to component manufacturers on basis of these documents.
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The new generation of the coplanarity module with 3D sensors is available immediately for Siemens’s Siplace X2 and X3 placement solutions. Instead of with a laser dot, electronic components are now scanned with a laser line whose scattered-light reflections are converted into height information by a powerful 3D sensor. By analyzing the difference between component and board heights, the system makes sure that all contacts are sufficiently deeply embedded into the solder paste (provided that the solder paste was flawlessly applied). And if the difference of level of the connections for pins and balls exceed a preset tolerance level, the placement heads discards the respective component.
Thanks to its line scanning and 3D sensor technology, the Siplace Coplanarity Module operates twice as fast as competitors’ technologies. For example, scanning a QFP 100 takes less than 600 milliseconds. By eliminating the additional vision test, the system is faster than competitive systems and improves the productivity and efficiency of the entire SMT line.
Quality problems due to insufficient solder connections resulting from bent pins on QFPs, connectors and SO components and incorrectly varying ball diameters on BGAs are reliably prevented. This prevents expensive rework. For example, faulty solder connections on the bottom of BGAs are only detectable with X-ray equipment are very difficult to repair. In addition, customers can rest assured that the durability of modules won't be reduced in the field as a result of unreliable solder connections, which in turn may lead to expensive failures.
Vision dumps for systematic process improvements
Other benefits of the new generation of Siplace Coplanarity Modules include their easy operability and the ability to store vision dumps, i.e. test logs with visual and analytical data). Via software, the user is able to easily configure process parameters such as component tolerances or solder paste thicknesses. The results of the coplanarity tests are output together with the results of the other Siplace vision systems, which makes the manufacturer's quality control and fault analysis procedures a lot easier. In addition, the system stores test logs with visual and analytical information of faulty components. Based on these vision dumps, electronics manufacturers can troubleshoot and improve their processes much more easily and effectively than before. Additionally, error data complaints are easier to explain to component manufacturers on basis of these documents.
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