Almit Ltd is unveilling a range of leading-edge solder technologies,
including the value-driven SR-37 LFM-22S lead-free cored solder wire
and its new LFM 48 N Dipping Paste.
Almit’s SR-37 LFM-22S cored solder wire has been developed
expressly to reduce material costs. This innovative new formulation
also enhances cost-efficiency and yield through a range of tip-saving
properties. As a no-clean material, the SR-37 LFM-22S is ideal for
manufacturers who don’t require silver in lead-free materials. By
removing this element from the mix, Almit has substantially reduced the
material cost to increase the accessibility of its advanced solder
technology.
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Productronica 2007 Exhibitors for this topic: |
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The new LFM 48 N Dipping Paste is a powerful alternative to gel pastes
traditionally used in BGA PoP (Package-on-Package) stacked device
applications and is ideal for holding larger area devices that often
exhibit warpage during reflow. The new Almit paste is a combination of
ultra-fine solder spheres and a flux vehicle optimised for a long open
time in a dipping tray. It offers reliability advantages to board
assemblers at both solder melt and peak reflow temperatures.
Visitors to NEW can also see Almit’s SR-7 a high reliability
general purpose liquid rework flux. SR-7 presents today’s
manufacturers with a no clean, low residue and halide free technology
for both lead-free and conventional tin-lead solders. Optimised to
deliver a high soldering performance with a range of printed circuit
board finishes – from lead-free HASL to immersion silver, tin
ENIG and OSP – the highly reliable Almit SR-7 is ideally suited
to re-working or post mass soldering applications.
National Electronics Week visitors can also discover Almit’s
increasingly popular SJ7 solder alloy. SJ7 offers significant
mechanical advantages over conventional tin-lead solders and is being
widely adopted in automotive, aerospace and military applications. The
alloy is optimised for high demand conditions involving thermal cycling
and high strain. Improved tensile and creep strength, time to rupture,
wetting capabilities and yield are just some of the performance
benefits associated with this breakthrough solder technology.
Stand C14 will feature an extensive range of proven Almit solder
technologies, including the LFM-48 TM HP (S) fast-print solder paste
currently being deployed around the world at excursion speeds of up to
100 mm/sec to drive up productivity through substantially reduced tact
time.
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