PRODUCT INNOVATIONS
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New measurement and analysis capabilities optimize production process
CeTaQ is to launch two new advanced services. The CmController5 Compact
(CmC5 Compact) are designed with the know-how to help users analyse and
optimize their production process in the pursuit of error rate
reduction. The mobile CmC5 Compact is a dedicated tool for machine and
process capability analysis and includes a complete measurement system,
with easy to use software for vision and statistical analysis.
Visitors at SMT will also have an opportunity to discuss two completely new services being launched at the SMT Show, to further improve CeTaQ’s measurement and analysis capabilities. These include their Pick and Place Pressure Measurement Service. The smaller the component, the more sensitive it is, so it is important to use the correct placement force to avoid any damage. With the use of smaller components on the increase, this new service is designed to help manufacturers regularly monitor that the correct pressure is being applied. Manufacturers using Wire Bonding Equipment should visit the CeTaQ stand to discuss the launch of their Wire Bonding Measurement Service, designed to measure the machines capability and optimise the process.
CeTaQ will also demonstrate their Components and Glass Plates for Measurement and Calibration. Designed to precisely imitate "live" components and real printed circuit boards, they can be processed like standard production components to eliminate faulty components as a potential source of error. CeTaQ has eliminated the problems normally associated with glass components as the pin structures are on the side of the glass which faces the camera, so any refraction that occurs does not affect the measurement. They have also been mounted in a synthetic housing that accurately simulates the process characteristics of production components and at the same time prevents breakage. The glass plates and components have fiducial style reference marks to allow the user to measure the exact position of the components.
Visitors at SMT will also have an opportunity to discuss two completely new services being launched at the SMT Show, to further improve CeTaQ’s measurement and analysis capabilities. These include their Pick and Place Pressure Measurement Service. The smaller the component, the more sensitive it is, so it is important to use the correct placement force to avoid any damage. With the use of smaller components on the increase, this new service is designed to help manufacturers regularly monitor that the correct pressure is being applied. Manufacturers using Wire Bonding Equipment should visit the CeTaQ stand to discuss the launch of their Wire Bonding Measurement Service, designed to measure the machines capability and optimise the process.
CeTaQ will also demonstrate their Components and Glass Plates for Measurement and Calibration. Designed to precisely imitate "live" components and real printed circuit boards, they can be processed like standard production components to eliminate faulty components as a potential source of error. CeTaQ has eliminated the problems normally associated with glass components as the pin structures are on the side of the glass which faces the camera, so any refraction that occurs does not affect the measurement. They have also been mounted in a synthetic housing that accurately simulates the process characteristics of production components and at the same time prevents breakage. The glass plates and components have fiducial style reference marks to allow the user to measure the exact position of the components.
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