News, resources and business contacts
for the global electronics industry
HOME
ELECTRONIC COMPONENTS, SYSTEMS, APPLICATIONS
ELECTRONIC MANUFACTURING
INDUSTRIAL TOPICS
BUSINESS LIFE
EVENTS
COMPANY INDEX
CAREER CENTER
KEYWORD SEARCH
Keyword
Search
COMPANY INDEX
PARTNER
|
Deutsch
Industrial Topics
PRODUCT INNOVATIONS
-
Vi Technology - AOI Solutions
AOI with large boards capability and multi-lanes option
ViTechnology introduces its new AOI series Vi5K/7K with large boards capability and multi-lanes option. The Vi5K/7K series is a complementary product in ViTechnology product range with a 21’’ x 21’’ board capability for Vi5K and 21’ x 24’’ board capability for Vi7K. This one will be also supporting dual lane capabilities with a 21’’ x 11’’ board size.
More articles in this category:
PRODUCT INNOVATIONS
more articles (61)
Reinhardt Microtech - technology news
Solid copper filled via in thin film technology
Finetech - all-in-one solution
Rework of QFN – no compromises
ERSA - increased throughput and flexibility
New selective platform for high volume in-line soldering
ANALYSIS-MARKET-TRENDS
more articles (5)
Seventy Fab projects brighten industry outlook in 2009
World Fab forecast projects over 20% in increase in fab spending in 2009
Electronics.ca Publications - Industry Report
40% of the world's PCB is produced in the uppermost manufacturing bases - China and Taiwan
EMS - ODM - CM Industry
Global contract manufacturing transforms by 2013
NEWS
STMicroelectronics, STATS ChipPAC and Infineon
Milestone in establishing wafer-level-packaging industry standard
Essemtec
New Website with integrated application reports
At VLSI Symposium
IMEC reports progress on simplified high-k/metal gate process for the 32nm node
APPLICATIONS
Heller Industries - Reflow ovens
Reflow ovens solution to the challenges of increased productivity and greater flexibility
Current events
electronicIndia
September 02-05, 2008
electronicAsia
October 13-16, 2008
electronica
November 11-14, 2008
electronica & ProductronicaChina
electronicAmericas
Productronica
News - 08.09.2008
Automotive MEMS sensor market to nearly double by 2012
Driven by new government mandates, global shipments of automotive Microelectromechanical Systems (MEMS) sensors are expected to nearly double from 2006 to 2012, according to iSuppli Corp.
Rework of QFN – no compromises
With the “Direct Component Printing (DCP) Module”, Finetech offers an all-in-one solution for all FINEPLACER rework stations. After the QFN component has been placed on the printing stencil using the FINEPLACER beam splitter optics, new solder paste can be applied consistently with a mini squeegee.
The official career portal of
e
lectronica
PRODUCT INNOVATIONS - 
back
top
