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PRODUCT INNOVATIONS - ACE - selective soldering equipment
"True position” high accuracy selective soldering

ACE Production Technologies announces the availability of a new high-accuracy option for its line of selective soldering equipment. ACE’s Linear Encoder technology provides closed-loop feed-back, indicating the exact location of the solder nozzle; this gives ACE systems a repeatable, overall system accuracy of +/- 0.001".

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PRODUCT INNOVATIONS

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DuPont - polymers based on renewable resources
Tailored thermoplastics exceeding traditional materials

Hesse & Knipps - Wire bonder
Wire bonder for solar market

Mirtec - desktop AOI machine
AOI Systems for manufacturing defects both pre and post reflow

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ANALYSIS-MARKET-TRENDS

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EMS - ODM - CM Industry
Global contract manufacturing transforms by 2013

Silicon solar production initiatives
Thin-film technology - new solar PV trend in Taiwan

Gartner - Worldwide wafer fab equipment
Worldwide semiconductor capital equipment spending to decline 22 percent in 2008



	NEWS

STMicroelectronics, STATS ChipPAC and Infineon
Milestone in establishing wafer-level-packaging industry standard

Essemtec
New Website with integrated application reports

At VLSI Symposium
IMEC reports progress on simplified high-k/metal gate process for the 32nm node

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News - 20.08.2008

Milestone in establishing wafer-level-packaging industry standard
Leading semiconductor makers team up with advanced packaging provider to jointly develop next-generation of eWLB wafer-level packaging technology.

New Website with integrated application reports
The leading Swiss Manufacturer of production systems for Electronics renews it's web presentation on August 5, 2008. Beside product information the new page also offers valuable application reports and sophisticated technological background.