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Reinhardt Microtech - technology news
Solid copper filled via in thin film technology
Reinhardt Microtech keeps in touch with today’s increasing demands on substrate performance. As the circuits in the field of RF applications are improving in performance, also the substrates which carry the circuits have to. One outstanding example is the use of solid filled via to realize the electrical connections between front and back side of substrates. While many competitors in this field are still struggling with problems, Reinhardt Microtech developed a reliable, high-yield production method therefore.
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PRODUCT INNOVATIONS
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Finetech - all-in-one solution
Rework of QFN – no compromises
ERSA - increased throughput and flexibility
New selective platform for high volume in-line soldering
AMO - graphene crystallites
Graphen-Substrate made in Germany
AlternativeSMT at Electronic India 2008, September 2nd to 5th at Bangalore
FeederMaster - a multi-platform feeder test jig
AMO - graphene crystallites
Graphen-Substrate made in Germany
Fraunhofer-Institut für Werkstoffmechanik IWM
Computer simulates thermal stress
Schroff - Customising cabinets
Individually modified standard cabinets
Essemtec - automated stencil printer
New automated printer with sideways moving loading drawer
3D Systems - 3-D Printer
New affordable, high-definition 3-D printer
Viscom - AOI/AXI
In-line X-ray inspection with parallel AOI/AXI
Speedprint - stencil printer
New smallest inline stencil printer
JTAG Technologies - boundary-scan
Easy-to-use software tool with extraordinary test comprehensiveness
Essemtec - twin vacuum table
New placement machine for flex board and film substrate features twin vacuum table
ACE - selective soldering equipment
"True position” high accuracy selective soldering
DuPont - polymers based on renewable resources
Tailored thermoplastics exceeding traditional materials
Hesse & Knipps - Wire bonder
Wire bonder for solar market
Mirtec - desktop AOI machine
AOI Systems for manufacturing defects both pre and post reflow
Laser Lines
Laser marking printed label
Transition Automation - Paste Manager
Electronic paste manager self-cleaning squeegee system
Essemtec - screen/stencil printer
New semi-automatic printer with vision and stencil cleaning
Manncorp - pick and place system
Low-to-mid-volume placers for long-term reliability
GeBE Elektronik und Feinwerktechnik
Compact kiosk printer for space sensitive installations
DuPont Microcircuit Materials - Frontside Metallization
Thick-film metallization paste delivers up to 0.5% more efficiency for PV cells
ACS - motion controller
Motion controllers provide sub-nanometer resolution
Schroff - MicroTCA
Compact new MicroTCA system allows horizontal board mounting
Rittal - low-voltage switchgear systems
Better protection against accidental arcing
XACTIX and Surface Technology Systems
CVE Etch Module for xenon difluoride gas
Rittal - battery manager
Longer life for UPS batteries
Rittal - Bayable server cooling
Flexible, high-performance climate control with monitoring and without raised floor
Knürr - dynamic cooling system
Energy efficiency with optimum server virtualization management
S+P Samson - industrial identification
New high temperature labelling and RFID-based warehouse management systems
Edac - IDC contacts
IDC contact for surface mount saves costs
Soldering and Rework System
OK International looks forward to ElectronicIndia 2008
Data I/O - inline automated programming solution
Just-in-Time programming solutions for automotive applications
Asmetec - MiniScope
Handheld digital microscope
Wacker Chemie - UV-active silicone elastomers
UV-active silicones for the microelectronics industry
Moritex - industrial endoscopes
Portable video endoscope offers full multimedia capabilities
austriamicrosystems - analog/mixed-signal designs
High-Voltage IO library offering 4KV ESD protection
Essemtec - product quality
Measurement option verifies components directly in the placement machine
Moritex - borescopes
Inspecting mission-critical manufactured parts, components and products
Siemens - Coplanarity Module
Closer to zero-defect production - with fast 3D sensors
IMEC - thin crystalline silicon wafers
New promising method to fabricate ultra-thin silicon solar cells
Rittal - cooling unit
Energy costs and CO2 emissions cut by 30 percent
Manncorp - full-vision placement system
Full-vision placement system for prototyping and mid-size production
Omron - snap mounting system
Install photosensors ten times as fast
Komax - machine software
Barcode scanner and material change detection
Komax - Quick-change tool system
Quick-change tool systems reduces changeover times
Stäubli Robotics - high speed robot
New machining robot to operate in difficult and wet conditions
JTAG Technologies - boundary-scan integration
Boundary-scan integration - pin-card controller simplifies installation and portability
Zwick - Plastics Testing Initiative
New products for testing plastics
Manncorp - reflow oven
New batch-type lead-free reflow oven for low-volume users
Heller Industries - reflow system
New reflow system - user-initiated solutions
Precitec Optronik - thickness measurement
New measuring system registers the silicon thickness with just one sensor
Aegis Software - real-time production
Aegis iMonitor 2.0 redefines real-time factory monitoring
3D-Micromac at Intersolar 2008
Innovative laser micromachining for production of photovoltaic systems
Moritex - industrial endoscope
New small diameter industrial endoscope
MSD and Totech Super Dry
New revolutionary handling process
OKW Gehäusesysteme
From standard solutions to individual solutions
LPKF - PCB On-Demand
PCBs at the press of a button
Aeroflex - Flying Probe System
New stand-alone flying probe system for flexible fixtureless test
AMS Technologies - solid state UV laser
UV marking without thermal damage of material
Rofin - programmable IC markers
High speed laser marking for semiconductors
Essemtec - SMT placement equipment
New modular component placement systems
Linn High Therm - tube furnace
Tube furnace for fast cycle times under protective gas and vacuum
ANALYSIS-MARKET-TRENDS
more articles (5)
Seventy Fab projects brighten industry outlook in 2009
World Fab forecast projects over 20% in increase in fab spending in 2009
Electronics.ca Publications - Industry Report
40% of the world's PCB is produced in the uppermost manufacturing bases - China and Taiwan
EMS - ODM - CM Industry
Global contract manufacturing transforms by 2013
NEWS
STMicroelectronics, STATS ChipPAC and Infineon
Milestone in establishing wafer-level-packaging industry standard
Essemtec
New Website with integrated application reports
At VLSI Symposium
IMEC reports progress on simplified high-k/metal gate process for the 32nm node
APPLICATIONS
Heller Industries - Reflow ovens
Reflow ovens solution to the challenges of increased productivity and greater flexibility
Current events
electronicIndia
September 02-05, 2008
electronicAsia
October 13-16, 2008
electronica
November 11-14, 2008
electronica & ProductronicaChina
electronicAmericas
Productronica
News - 06.09.2008
Rework of QFN – no compromises
With the “Direct Component Printing (DCP) Module”, Finetech offers an all-in-one solution for all FINEPLACER rework stations. After the QFN component has been placed on the printing stencil using the FINEPLACER beam splitter optics, new solder paste can be applied consistently with a mini squeegee.
World Fab forecast projects over 20% in increase in fab spending in 2009
According to the World Fab Forecast report, recently released by SEMI, a projected decline in world semiconductor fab equipment spending of 20 percent is expected for 2008, but a rebound of over 20 percent in spending is expected in 2009, driven by over seventy fab projects. The August 2008 edition of the report lists 53 fab equipping projects and up to 21 construction projects for fabs in 2009.
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