global-electronics.net - Industrial Topics


	News, resources and business contacts for the global electronics industry

Messe München GmbH

Elektronik, Elektrotechnik bei Mercateo online kaufen

|

Industrial Topics

category

PRODUCT INNOVATIONS - GeBE Elektronik und Feinwerktechnik
Compact kiosk printer for space sensitive installations

Thermal printer manufacturer GeBE Elektronik und Feinwerktechnik GmbH is introducing its printer module GPT-6773. A special feature of this 200mm/s fast kiosk printer for 82.5mm paper width and up to 300mm roll diameter is the fact that its controller GCT-6794, which was developed by GeBE, is installed between cutter and printer mechanism.

More articles in this category:

category

PRODUCT INNOVATIONS

more articles (59)

more articles

DuPont Microcircuit Materials - Frontside Metallization
Thick-film metallization paste delivers up to 0.5% more efficiency for PV cells

ACS - motion controller
Motion controllers provide sub-nanometer resolution

Schroff - MicroTCA
Compact new MicroTCA system allows horizontal board mounting

category

ANALYSIS-MARKET-TRENDS

more articles (8)

more articles

EMS - ODM - CM Industry
Global contract manufacturing transforms by 2013

Silicon solar production initiatives
Thin-film technology - new solar PV trend in Taiwan

Gartner - Worldwide wafer fab equipment
Worldwide semiconductor capital equipment spending to decline 22 percent in 2008



	NEWS

STMicroelectronics, STATS ChipPAC and Infineon
Milestone in establishing wafer-level-packaging industry standard

Essemtec
New Website with integrated application reports

At VLSI Symposium
IMEC reports progress on simplified high-k/metal gate process for the 32nm node

Messe München GmbH

Messe München GmbH

back

top

Messe München GmbH

events

Current events

electronicIndia
September 02-05, 2008 link

electronicAsia
October 13-16, 2008 link

electronica
November 11-14, 2008 link

News - 08.08.2008

Milestone in establishing wafer-level-packaging industry standard
Leading semiconductor makers team up with advanced packaging provider to jointly develop next-generation of eWLB wafer-level packaging technology.

New Website with integrated application reports
The leading Swiss Manufacturer of production systems for Electronics renews it's web presentation on August 5, 2008. Beside product information the new page also offers valuable application reports and sophisticated technological background.