Industrial Topics 
Computer simuliert Hitzestress category PRODUCT INNOVATIONS - Fraunhofer-Institut für Werkstoffmechanik IWM
Computer simulates thermal stress

A new simulation method has made it possible to predict in record time when and where heavily stressed engine components are likely to fail. Car manufacturers can thereby significantly reduce the time for developing new engine components. go

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Messe München GmbH
Messe München GmbH
category PRODUCT INNOVATIONS
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Messe München GmbH
Messe München GmbH
Schroff - Customising cabinets
Individually modified standard cabinets go
Essemtec - automated stencil printer
New automated printer with sideways moving loading drawer go
3D Systems - 3-D Printer
New affordable, high-definition 3-D printer go
Messe München GmbH
Messe München GmbH
category ANALYSIS-MARKET-TRENDS
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Messe München GmbH
Messe München GmbH
Electronics.ca Publications - Industry Report
40% of the world's PCB is produced in the uppermost manufacturing bases - China and Taiwan go
EMS - ODM - CM Industry
Global contract manufacturing transforms by 2013 go
Silicon solar production initiatives
Thin-film technology - new solar PV trend in Taiwan go
Gartner - Worldwide wafer fab equipment
Worldwide semiconductor capital equipment spending to decline 22 percent in 2008 go
DuPont Electronic Technologies
Raw material, transportation and energy costs - global price increase go
SEMI - Semiconductor manufacturing equipment
First quarter of 2008 worldwide semiconductor manufacturing equipment go
iSuppli - EMS/ODM outlook
EMS/ODM Industry set to undergo slowdown go
European Commission
EU to double its R&D investment in robotics go
Electronics.ca Publications - Global Electronics Production
US, Japan and Western Europe continue to lose share of Global Electronics Production go
Messe München GmbH
Messe München GmbH
category NEWS
Messe München GmbH
Messe München GmbH
STMicroelectronics, STATS ChipPAC and Infineon
Milestone in establishing wafer-level-packaging industry standard go
Essemtec
New Website with integrated application reports go
At VLSI Symposium
IMEC reports progress on simplified high-k/metal gate process for the 32nm node go
Messe München GmbH
Messe München GmbH
category APPLICATIONS
Messe München GmbH
Messe München GmbH
Heller Industries - Reflow ovens
Reflow ovens solution to the challenges of increased productivity and greater flexibility go