AUTOMOTIVE INNOVATION 
category ANALYSIS-MARKET-TRENDS - ecs: Price reductions significantly slowing down
Trend for automotive electronics prices changes

The analysis of price developments for automotive electronic components shows: the times of price reductions over the whole range of electronic devices have come to an end. Rising energy and raw material cost finally also have their impact in electronics.  go


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National Semiconductor - LVDS
Industry’s first AEC-Q100 compliant LVDS crosspoint switches, drivers and receivers go
MOST Cooperation - automotive Ethernet
Automotive-ready physical layer for Ethernet in the car go
Delphi - cable
Halogen-free ultra-thin-wall cable for multiple vehicles go
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category ANALYSIS-MARKET-TRENDS
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IMS Research - Report
Growth in the market for automotive sensors go
IMS Research - report
Is it boom time for automotive electronics in India? go
iSuppli warns:
U.S. falling behind in eco-friendly car electronics go
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category NEWS
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electronica automotive conference:
Secure early booking prices now for the expert forum on automobile electronics go
Joint research project started
BMZ, University of Applied Sciences Aschaffenburg and Linde develop energy storage system for electric vehicles go
Cars that talk
Commission earmarks single radio frequency for road safety and traffic management go
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category EVENTS
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Munich International Congress Center (ICM)
electronica automotive conference 2008 with Experts from Leading International Companies go
Booming market India
"Call for Presentations" for the Automotive Symposium running parallel to "electronicIndia 2008" go
EMBEDDED SYSTEMS 
category PRODUCT INNOVATIONS - Linear Technology - Hot Swap controller
Integrated 2Amp MOSFET & sense resistor provides compact hot swap solution

Linear Technology introduces the LTC4217, a 2A integrated Hot Swap controller for protecting low power boards with load supply voltages ranging from 2.9V to 26.5V. Like other Hot Swap devices, the LTC4217 allows a board to be safely inserted and removed from a live backplane by limiting the amount of inrush current to the load supply during power up. go


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Curtiss-Wright Controls
New rugged single board computer go
Epson Toyocom - oscillator
Low-jitter, low phase noise SAW oscillator supports for high-speed interfaces go
Linear Technology - PMIC
Switch mode USB power manager, buck-boost, boost & dual buck regulator go
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category ANALYSIS-MARKET-TRENDS
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SIA - Worldwide sales of semiconductors
July chip sales up 7.6 percent Year-on-Year go
IMS Research - Report
Medium voltage motor drives market grows rapidly as energy prices soar go
Vishay Siliconix - MOSFETs
p-channel power MOSFETs in the PowerPAK SC-75 go
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category NEWS
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Texas Instruments - embedded systems
Texas Instruments, a key member of the IEEE working group, announced that it is driving the ratification of the IEEE 1149.7 standard, a new two-pin test and debug interface standard that supports half the number of pins of the IEEE 1149.1 technology, allowing developers to easily test and debug products with complex digital circuitry, multiple CPUs and applications software in products such as mobile and handheld communication devices. go
Online ticket registration for visitors to the electronica 2008
Be sure to get your entrance ticket now to benefit from attractive prices go
International CEO Round Table during electronica 2008
What contribution is the semiconductor industry making to climate protection? go
MICRONANO-SYSTEMS 
category ANALYSIS-MARKET-TRENDS - iSuppli - Microelectromechanical Systems
Sensors take the growth baton in the global MEMS market

Driven by new demand from consumer electronics and wireless applications, the global market for Microelectromechanical Systems (MEMS) will expand to $8.8 billion in 2012, up from $6.1 billion in 2006, iSuppli Corp. predicts. go


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STMicroelectronics and Debiotech
First prototypes of disposable insulin nanopump go
STMicroelectronics - 3D orientation sensor
New 3D orientation sensor using robust MEMS technology go
MMI/ks
New cost-optimized 3-axis accelerometer miniaturizes motion sensing go
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category ANALYSIS-MARKET-TRENDS
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micronano-systems
Multiple MEMS potential will provoke market explosion go
MEMS-based oscillators
WTC says MEMS timing ready for prime time go
Electronics.ca Publications - Nanotechnology
Global Market for Nanotechnology slated for high growth through 2013 go
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category NEWS
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micronano-systems
Nano charges to rescue lithium go
micronano-systems
Nanowires with large scale ambitions go
University of Southampton (ECS) - Single-electron transistors
New high performance, low power sensor at nanoscale go
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Messe München GmbH
category EVENTS
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Messe München GmbH
Thurs 19th March 2008, The Royal Society, London
3rd International Conference on Nanotechnology and Smart Textiles for Industry, Healthcare and Fashion go
WIRELESS COMMUNICATION 
category PRODUCT INNOVATIONS - Gleichmann - wireless communication
Adapter enables wireless data transfer in the frequency range of 5 to 10 GHz

NEC Electronics’ µPD720180A device wire adapter (DWA), which immediately broadens Gleichmann Electronics’ product portfolio, was specifically designed for wireless communication between Wireless USB 2.0 compatible PCs or other Wireless USB 2.0 host systems and compatible peripheral and multimedia devices. go


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Gleichmann - NEC host controller
Wireless USB host controller enables wireless data transfer rates of up to 480 Mbits/s in a range of 3 meters go
Rohde & Schwarz - mobile radio scanner
Universal mobile radio scanner for setting up and optimizing WiMAX networks go
AnalogicTech - step-down converters
High voltage step-down converters boost power efficiency of networking, wireless LAN equipment go
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category ANALYSIS-MARKET-TRENDS
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Forward Concepts - new annual study
Cellular Handset & Chip Markets '08 go
iSuppli - wireless semiconductor market
Wireless semiconductors outgrow overall chip market in 2007 go
In-Stat - embedded Wi-Fi
Wi-Fi in Consumer Electronics: What Will the Future Bring? go
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Wireless
Focus on best fit for ZigBee go
Wireless
Hitting the wireless market running go
Wireless
Adding a new dimension to wireless device packaging go