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PRODUCT INNOVATIONS - Xilinx and Eutecus - analytics suite
New programmable embedded video analytics platform

Xilinx and Alliance Program member Eutecus present the industry's first full video analytics suite on a single field programmable gate array (FPGA). The analytics suite leverages the digital signal processing capabilities of the Xilinx Spartan-3A DSP FPGA platform and a Multi-core Video Analytics Engine (MVE)) from Eutecus.

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PRODUCT INNOVATIONS

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Cypress - detection solution
Proximity sensing solution delivers industry-leading detection range of up to 25 centimeters

Lattice Semiconductor - FPGAs
Low power cores bolstered with enhanced buffer management features

Aster Technologies - coverage analysis tools
New generation of "easy to use" test coverage analysis tool

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ANALYSIS-MARKET-TRENDS

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Indian Wireless Market
WiMAX, 3G and number portability to drive Indian Wireless Market in 2009

In-Stat’s report
New SSD makers hitting the market

According to ABI Research
Wi-Fi chipset revenue on course to approach $3 Billion in 2008

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NEWS

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Final Report - electronica 2008
Electronics industry pins great hopes on “green electronics”

electronica 2008
Expectations more than fulfilled: electronica automotive conference 2008

130 companies from ten countries:
New trade fair hybridica getting off to a fantastic start



	EVENTS

Munich International Congress Center (ICM)
electronica automotive conference 2008 with Experts from Leading International Companies

Booming market India
"Call for Presentations" for the Automotive Symposium running parallel to "electronicIndia 2008"

Thurs 19th March 2008, The Royal Society, London
3rd International Conference on Nanotechnology and Smart Textiles for Industry, Healthcare and Fashion

Industrial Topics

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PRODUCT INNOVATIONS - JTAG Technologies - scan module
Digital I/O scan module ideal for implementing boundary-scan and functional tests

JTAG Technologies has introduced the new compact JT 2149/MPV Digital I/O Scan (DIOS) module, which allows digital I/O test access to PCBs requiring external I/O stimulus and response monitoring.

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PRODUCT INNOVATIONS

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Baumer Electric - compact drives
Fast and Reliable Positioning

Vitronics Soltec - good soldering results
Closed-loop preheater control ensures linear ramp profile, precise selective soldering control

Essemtec - inline pick&place
New Pick & Place for 3D-MID

MSD - Superdry
New generation MSD control cabinets

Laser 2000 - Inkjet Printing System
Higher flexibility with inkjet printing systems for ophthalmic lens manufacturers

Weiss Umwelttechnik - temperature and climate test chambers
The climate under control

Manncorp - solder dipping system
Lead-free solder dipping system replaces manual methods

Aster Technologies - coverage analysis tools
New generation of "easy to use" test coverage analysis tool

JTAG Technologies
Digital I/O scan module ideal for implementing boundary-scan and functional tests

Essemtec - SMD-silicone keys
Automatic SMD insertion of silicone keys

Momentive - prepolymers
Prepolymers offer high tensile strength for next-generation structural adhesives

IMS CHIPS and Robert Bosch
Contract to jointly develop and commercialize a fabrication process for ultra-thin chips

Provertha - multi-sensor measurement system
3D video multi-sensor measurement technology for the manufacturing of precision plastic parts

OKW Gehäusesysteme - cases
Small cases - attractive to carry

Hover-Davis - automatic labeler
LPFN preprinted label feeder for Fuji

SMAC - Moving Coil Actuator
Precision long life actuators for PCB assembly

bedra - coated EDM wires
New coated EDM wires for higher cutting speeds

Aerotech - galvo scanning head
Synchronised scanner extends the field of view for scanning head laser systems

PA&E - Aluminum Silicon Carbide heat sink
AlSiC heat sinks offer reduced weight and improved thermal conductivity

Indium Corporation - solder paste technology
First Rosin-Free, No-Clean, Cored Wire Solder

Ziptronic direkt bond interconnect technology
Low temperature process employs nickel for reliable bonding without compression

OK International - Soldering and Rework System
New soldering and rework systems increase production throughput and assure precision control

Weidmüller - electronics housing system
Modular electronics housing system provides a home for individual electronics solutions

Dual lane platform
DEK boosts throughput and flexibility with new Dual Lane RTC platform

Vitronics Soltec - Precise Soldering Control
Selective Soldering System now features a wave height measurement system

Alltec - fiber laser markers
New fiber laser marker family features the most compact design for unrivalled versatility

Rittal at electronica 2008 - new subrack
Fast assembly, mechanical stability and simple handling

Kulicke & Soffa - hub dicing blades
New series of hub dicing blades

Binder - climatic chambers
New series of climatic chambers for constant conditions

Manncorp - solder machine
Lead-free wave solder machine offers big performance in small space

RPS - selective soldering systems
New selective soldering system delivers industries largest capacity native selective soldering range

Veeco - Web Coating Systems
New high throughput web coating platform for production of flexible thin film solar cells

APS Novastar - Vision Control
Automated vision control for pick and place systems

Pixargus - complete inspection of tubing surface
First-ever optical inline inspection of transparent tubing

Rittal - 60-mm busbar system
First busbar system with "cULus-listed" approval

Newport - thin film photovoltaic laser scribing systems
High throughput thin film photovoltaic laser scribing system

Yxlon - at electronica 2008
Tape and reel inspection solution

DEPRAG Schulz - Micro-Assembly-System
Assembly in the smallest of work areas

Newport - laser scribing system
Thin film photovoltaic laser Scribing system

J. Schmalz - Needle grippers
Needle grippers work where vacuum fails

Novatec - production control tools
New suite of production control tools offering track and trace capabilities

IPTE - Pin Insertion Machine
New innovative standards in press-fit technology

KLA-Tencor - wafer inspection system
New monitor-wafer inspection system for the integrated circuit market

Viscom - system for automatic wire bond inspection
Inspecting extremely small wire diameters at high speeds is now possible with wire bond AOI system

Fexible SMD assembly system
Essemtec shows pick&place system FLX2011 at Electronica 2008

OK International - soldering system
Soldering system with enhanced thermal control

Essemtec - stencil printer
Semi-automated paste printer features for vision system

Aqueous Technologies
New automatic defluxing and cleanliness testing system

RHE Microsystems - thermal management
Thick copper layer using thin film technology

DEK - 2D Inspection
Software tool with 2D Inspection control

IPTE - test cell
New test cell enables exact verification of objects to be tested with high pneumatic and hydraulic pressures in real-time

Finetech - Contactless solder removal solutions
Solder removal head for contactless residual solder removal at large components

DuPont Microcircuit Materials
Forward-looking technology in automotive electronic ceramic circuits using thick film compositions

Fritsch - standalone operation, batch system, inline system
For our automatic Pick&Placer - different feeding concepts for circuit boards

Vi Technology - AOI Solutions
AOI with large boards capability and multi-lanes option

Reinhardt Microtech - technology news
Solid copper filled via in thin film technology

Finetech - all-in-one solution
Rework of QFN – no compromises

ERSA - increased throughput and flexibility
New selective platform for high volume in-line soldering

AMO - graphene crystallites
Graphen-Substrate made in Germany

AlternativeSMT at Electronic India 2008, September 2nd to 5th at Bangalore
FeederMaster - a multi-platform feeder test jig

AMO - graphene crystallites
Graphen-Substrate made in Germany

Fraunhofer-Institut für Werkstoffmechanik IWM
Computer simulates thermal stress

Schroff - Customising cabinets
Individually modified standard cabinets

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ANALYSIS-MARKET-TRENDS

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SEMI - book-to-bill
North American semiconductor equipment industry posts september 2008 Book-to-Bill Ratio of 0.76

According to iSuppli:
Electronics contract manufacturing business to stay afloat during recession

Gartner says
Worldwide semiconductor capital equipment spending to decline 26 Percent in 2008

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NEWS

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Metal-free MID technology
New compound: Laser produces electrically conductive structures

3D-SIC technology
IMEC demonstrates 3D stacked integrated circuits

Fraunhofer ISE
39.7% – New European Record Efficiency for Solar Cells



	APPLICATIONS

Pixargus - optical inline inspection system
Complete surface inspection of cables

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events

Current events

electronica
November 11-14, 2008 link

electronica & ProductronicaChina
March 17-19, 2009 link

electronicAmericas
June 01-05, 2009 link

News - 21.11.2008

Proximity sensing solution delivers industry-leading detection range of up to 25 centimeters
Cypress Semiconductor announced that its proximity detection solution enables a best-in-class proximity detection range of 25 cm. Based on the market-leading CapSense touch-sensing technology, the solution leverages the flexible PSoC Programmable System-on-Chip architecture to deliver variable detection range and sensitivity along with desired system effects.

Low power cores bolstered with enhanced buffer management features
Lattice Semiconductor announced that its LatticeSCM FPGA family-based SPI4.2 MACO (“Masked Array for Cost Optimization”) cores have been enhanced by adding sophisticated link layer buffer management options. Compared to competitive FPGAs, the LatticeSCM FPGA family has offered the industry’s most feature-rich SPI4.2-based cores and bridge reference designs at the lowest cost, power and printed circuit board footprint.

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