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PRODUCT INNOVATIONS - Stäubli Robotics - high speed robot
New machining robot to operate in difficult and wet conditions

Stäubli Robotics announces the introduction of a new machining robot; the RX170 HSM (High Speed Machining). Stäubli has contributed several technological innovations to this project including the RX170HP robot.

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PRODUCT INNOVATIONS

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JTAG Technologies - boundary-scan integration
Boundary-scan integration - pin-card controller simplifies installation and portability

Zwick - Plastics Testing Initiative
New products for testing plastics

Manncorp - reflow oven
New batch-type lead-free reflow oven for low-volume users

Heller Industries - reflow system
New reflow system - user-initiated solutions

Precitec Optronik - thickness measurement
New measuring system registers the silicon thickness with just one sensor

Aegis Software - real-time production
Aegis iMonitor 2.0 redefines real-time factory monitoring

3D-Micromac at Intersolar 2008
Innovative laser micromachining for production of photovoltaic systems

Moritex - industrial endoscope
New small diameter industrial endoscope

MSD and Totech Super Dry
New revolutionary handling process

OKW Gehäusesysteme
From standard solutions to individual solutions

LPKF - PCB On-Demand
PCBs at the press of a button

Aeroflex - Flying Probe System
New stand-alone flying probe system for flexible fixtureless test

AMS Technologies - solid state UV laser
UV marking without thermal damage of material

Rofin - programmable IC markers
High speed laser marking for semiconductors

Essemtec - SMT placement equipment
New modular component placement systems

Linn High Therm - tube furnace
Tube furnace for fast cycle times under protective gas and vacuum

Thermo Fisher Scientific - analyzer
Real-time, continuous monitoring of up to ten gases with just one analyzer

DS Europe - forces and weights
New pancake load cells with analog and digital output

ConnectCode - multiple barcodes
Barcode fonts with Add-In for Excel simplifies creation of multiple barcodes

Fraunhofer-Gesellschaft - sensors with own power supply
Goodbye to batteries and power sockets

Cascade Microtech - Flicker Noise Measurement System
Industrys first fully integrated flicker noise measurement system

JTAG Technologies - boundary-scan interface
New JTAG module simplifies high-speed integration of boundary-scan

Almit - solder wire
Innovative solder technologies

IPTE - test handlers
Multi Test Handler system supports fast and efficient processing

DuPont - fluoropolymers
Fluoropolymers for electrical insulation

DEK - manufacturing solution
New print platform is designed to be easily scalable for long-term flexibility

Almit - dipping paste
New dipping paste addresses device warpage & PoP applications

Alchimer - Wet electrochemical process
New TSV metallization product with cost of ownership 75% less than PVD

SUSS MicroTec boosts Nanotechnology with new toolset for mask aligners
SUSS MicroTec boosts Nanotechnology with new toolset for mask aligners

Seica - future in test
Brand new flying prober

CeTaQ - measurement and analysis tool
New measurement and analysis capabilities optimize production process

Electrovert - wave soldering system
New wave soldering system featuring lead-free process capability

Essemtec - material dispensing and consecutive placement
Ability to dispense material and place LEDs on film substrates

KIC - thermal profile
Automatic profiling system

Europlacer - intelligent feeder technology
New SMT platform with higher feeder count

OK International - array package rework system
New array package rework system with dual convection bottom-side heating for lead-free rewor

Du Pont de Nemours - cable
Hytrel cable provides effective electrical insulation and toughness in thin layers

EFD - valve
Compact, engineered fluid dispensing systems increase throughput and improve yields

IPTE - CAD data conversion module
Low-cost depaneler offers new features and improved performance

Fraunhofer-Gesellschaft IOF
Soldered lenses

Optilia Instrument - vision microscopes
Visual inspection of solder balls of BGA, mBGA, CSP and Flip-Chip component

Keithley Instruments - Automated Characterization Suite
Test system now completes wafer level reliability testing up to five times faster

Essemtec - placement equipment
Component placement with maximum flexibility

OK International - new highlights
Soldering system to deliver high power with superior thermal control

Etek Europe - contamination tester
A localized cleanliness tester and extraction system

ACI Laser - Laser for trimming
Resistor trimming with laser technology

Trumpf - marking lasers
Ready to take on any marking job

Viscom - wafer inspection
Fully automatic wafer inspection for medium and large lot sizes

Siemens Electronics Assembly Systems Division
World record in real placement performance with more than 102,000 components per hour

Viscom - inspection system
Panoramic view into concealed solder joints

HumiSeal - coating solution
New water based coating protect electronics assemblies at temperature extremes

Heraeus Noblelight - infrared emitters
Infrared Emitters help speed up components manufacture

OK International - pre-heater
Focused convection pre-heater accelerates and enhances

Totech Superdry - drying and storage cabinets
Two new 1% dry cabinet models

Mydata - pick and place machines
The next generation of pick and place machines

Schroff - AdvancedTCA systems
Products conforming to NEBS for extreme condition

Vötsch Industrietechnik - drying oven
Explosion-proof heating and drying oven - the safe solution

STATS ChipPAC - Databook library of silicon IPDs
Tool to reduce cycle time and increase flexibility of RF designs

Kester - water-soluble paste
New low-voiding, lead-free water-soluble paste

Transition Automation - paste manager
Electronic paste manager self-cleaning squeegee system

QUISS - image processing
A new generation of Vision inspection systems

Lackwerke Peters - casting compounds
Black elastic casting compound for good contrast to LEDs

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ANALYSIS-MARKET-TRENDS

more articles (7)

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DuPont Electronic Technologies
Raw material, transportation and energy costs - global price increase

SEMI - Semiconductor manufacturing equipment
First quarter of 2008 worldwide semiconductor manufacturing equipment

iSuppli - EMS/ODM outlook
EMS/ODM Industry set to undergo slowdown



	NEWS

Soldertec Global - test service
China-RoHS test service for European Exporters

Keithley - Semiconductor Device Test Applications Guide
CD with semiconductor device test applications

New platform for the electronics assembly industry
Munich Trade Fairs International completes trade fair offering for SMT providers in Shanghai by partnering with IPC



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KUKA - lightweight robot
The SME worker's third hand

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News - 04.07.2008

New reflow system - user-initiated solutions
Heller Industries announces a true breakthrough in Reflow soldering technology with the new Mark III series. Heller utilizes a partnership approach with their customers to develop user-initiated solutions for real world applications.

EU to double its R&D investment in robotics
At the occasion of AUTOMATICA 2008 the European Commission has announced a policy to boost European robotics. The European Union will double its investments between 2007 and 2010 with almost € 400 million to support European robotics research. This ambitious programme aims to forge stronger links between academia and industry, and plans to fund a widespread experimentation by academic researchers and industry.